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Courses

Email info@idics.org to find out more about when these courses will be offered.

DIC 101: Practical Considerations for Good DIC Measurements

What is in the Good Practices Guide

Course Description

The Good Practices Guide for Digital Image Correlation (GPG) defines the knowledge and skills required to conduct DIC measurements in conjunction with mechanical testing of a planar test piece. Furthermore, the GPG defines the knowledge required to obtain Level 1 certification. The GPG is available at http://www.idics.org/guide.

This course will delve into all the topics covered in the GPG in detail, focusing on practical applications of DIC rather than theory or algorithms. It is designed as training for new practitioners of DIC to supplement vendor-based training, and as a refresher course for those who will be taking the Level 1 certification exam.

Course Content

  • Basic and fundamental 2D and Stereo-DIC concepts
  • Design of DIC measurements
  • Preparation for DIC measurements
  • Camera calibration
  • Test execution concepts
  • Strain calculations and basic Virtual Strain Gauge size studies
  • DIC processing techniques
  • DIC reporting requirements

Who Should Attend

DIC users who would like a thorough review of the iDICs Good Practices Guide for Digital Image Correlation (GPG). People who will be taking the Level 1 certification exam.

DIC 201: Advanced DIC Concepts and Uncertainty Quantification

Course Description

The advanced DIC class will cover what is underneath and beyond the Good Practices Guide (GPG). The theme will be to understand where DIC errors come from and work through all the components in DIC that lead to the measurement errors. For example, how to pick a DIC lens and camera (and why), what are the associated errors with various lenses and how do you quantify them. Why does the GPG specify 3-5-pixel speckles? What are the underlying principles? Understanding the camera calibration and the parameters and what makes a good calibration. Where does the matching uncertainty come from? Concepts of advanced uncertainty quantification on the DIC measurement will also be discussed including a thorough look at the 2D matching error magnitudes. Stereo-DIC errors and advanced virtual strain gauge studies will

Course Content

  • Uncertainty quantification: What influences my DIC measurement?
  • Factors in selecting a DIC lens
  • Selecting a DIC camera.
  • What makes a good DIC pattern and why.
  • Calibration: Understanding the parameters
  • Calibration: What makes a good calibration
  • 2D and pattern matching uncertainty.
  • Stereo-DIC uncertainty quantification
  • Understanding the VSG.

Who Should Attend

This course will go beyond the information needed for a Level 1 certification exam and target what is needed for Level 2 certification. All DIC users who would like to learn more about what influences their measurement accuracy.

Patterning for DIC

Course Description

Patterning is an essential part of every digital image correlation test setup. Although most users do avoid the worst-case scenario of “garbage in, garbage out” when it comes to patterning, there still seem to be a lot of non-optimum techniques and results in practice. Many users have concerns about their ability to produce high quality patterns without a lot of struggle, or a degree in Art. However, there are simple guidelines and methods that enable patterning to be a fast, easy and repeatable process, with straightforward quality metrics. This course will cover everything you need to know to confidently and quickly prepare any specimen for a DIC test and be sure that patterning will not be the limiting factor for obtaining the highest quality data.

Course Content

  • The Golden Rules of Patterning
  • Patterning for the Most Common Test Setups
  • Removing Human Factors from Patterning
  • Pros and Cons of Spray Paint, Ink, Rubber Stamps, Airbrushes, Markers….
  • Masking How’s and Whys
  • Pre-Test to Check Your Pattern (And Everything Else, Too)
  • (System Noise as Opposed to DIC Noise)
  • The Ideal Pattern vs The Real World
  • What to Do When Larger Dots Are Required
  • Evolution of Various Patterning Methodologies
  • Small-Scale and Microscale Patterning Techniques
  • What About Naturally Occurring Patterns?
  • High Temperature and Very High Temperature Patterning
  • Some Lighting Techniques (How to Make Your Patterns Look GOOD)
  • Most Common Beginner’s Mistakes
  • Bad Ways to Do Good Patterns
  • Fantastic Examples of Terrible Patterning

Who Should Attend

It is hoped that all current or potential users of DIC would benefit from this course.

The Grid Method

Course Description

The grid method is a technique suitable for in-plane displacement and strain measurement. It relies on a regular marking of the surface under investigation. The regular pattern acts as a spatial carrier, and the sought displacement components induce phase modulations of this carrier. Images of this regular marking, which progressively deforms during a test, can be advantageously processed with a spectral method. With the windowed Fourier transform, it is shown that displacement and strain components are obtained quasi-directly, which allows a fast and pixelwise determination of the displacement and strain fields. This course aims at providing the principle of this technique, with a special emphasis on its theoretical foundation and metrological performance. Practical aspects concerning its implementation will also be discussed.

Course Content

  • Marking surfaces with grids
  • Processing grid images to extract displacement and strain fields
  • Recent examples of use in mechanics of material and structures
  • Metrological performance: measurement resolution, bias, spatial resolution, relationship between these quantities. Link and comparison with subset-based DIC
  • Tutorial: processing various sets of grid images with Matlab programs provided to the attendees

Who Should Attend

Engineers and researchers who are seeking an alternative technique of DIC, in particular in cases for which a good compromise between spatial resolution and measurement resolution is needed.